The **ATS-13F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for electronic components like BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications The following table highlights the core physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13F-181-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40.00mm x 40.00mm | | **Height** | 10.00mm | | **Thermal Resistance** | 11.95°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Features and Design ### maxiFLOW™ Fin Design The "maxiFLOW" geometry features a tapered fin structure. This design increases the surface area and maximizes the performance of air convection, making it ideal for high-velocity airflow environments. ### pushPIN™ Attachment System This part uses the **pushPIN™** system, which offers several advantages for electronic assembly: * **Flexible Design:** It features a flexible mounting system that can be adjusted for different PCB hole patterns. * **Uniform Pressure:** The compression springs ensure a consistent and firm contact between the heat sink and the component, optimizing thermal transfer. * **Ease of Installation:** It allows for quick assembly and disassembly compared to traditional adhesive tapes. ### Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ## 3. Performance Summary The efficiency of this heat sink is highly dependent on the airflow (measured in Linear Feet per Minute - LFM). * **Low Airflow (1.0 m/s):** Higher thermal resistance (~11.95 °C/W). * **High Airflow (3.5 m/s):** Significantly lower thermal resistance (~4.40 °C/W). --- ## 4. Part Number Breakdown The suffixing provides information about the material and compliance: * **C2:** Refers to the Blue Anodized finish. * **R0:** Indicates that the part is RoHS (Restriction of Hazardous Substances) compliant.