The **ATS-13F-18-C2-R0** is a high-performance electronic component belonging to the thermal management category. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heatsink. | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the *pushPIN™* series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion | | **Base Dimensions** | 35mm x 35mm | Standard footprint for mid-sized chips | | **Height** | 15.00mm | Profile height (Low profile) | | **Attachment Type** | Push Pin | Uses spring-loaded plastic/brass pins for mounting | | **Thermal Resistance** | ~13.38°C/W (Unducted) | Efficiency of heat dissipation | --- ### 2. Electronic/Physical Components The assembly consists of four primary sub-components that ensure effective heat transfer: 1. **Heat Sink Body (Aluminum):** The main body features a "Fine Pitch" fin design. This increases the total surface area, allowing more heat to be transferred to the surrounding air via convection. 2. **Thermal Interface Material (TIM):** The **"C2"** in the part number indicates that this unit comes pre-applied with **T766 Phase Change Material**. This fills microscopic air gaps between the chip and the heatsink to minimize thermal resistance. 3. **Push Pin Mounting System:** The **"R0"** indicates the specific mounting kit. It typically includes: * **Pins:** Usually made of durable plastic or brass. * **Springs:** Provides consistent downward pressure (compression) to keep the heatsink flush against the heat source. 4. **Finish:** The **Blue Anodized** coating is not just for aesthetics; it provides an extra layer of protection against environmental wear and slightly improves radiant heat transfer. --- ### 3. Application Use Cases This specific model is commonly used in hardware environments where space is limited but thermal loads are significant: * **Networking Equipment:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and single-board computers (SBCs). * **Power Supplies:** Cooling voltage regulators and MOSFETs. --- ### 4. Thermal Performance at Airflow (LFM) Thermal resistance varies based on the speed of the air moving across the fins: | Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 13.38 | 4.95 | 2.69 | 1.96 | 1.60 |