The **ATS-13F-153-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed to optimize airflow and heat dissipation for high-heat electronic components like BGA (Ball Grid Array) packages. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Blue Anodized Aluminum | | **Thermal Resistance** | 4.05°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 40mm x 40mm | | **Height** | 20mm | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Spring Type** | Stainless Steel Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design and Construction The design of this heat sink is specialized for efficiency in constrained spaces: * **maxiFLOW™ Fin Geometry:** The fins are spread in a specific pattern to increase the surface area while minimizing pressure drop. This allows air to move through the fins more effectively than standard straight-fin designs. * **Aluminum Construction:** Lightweight with high thermal conductivity. The **Blue Anodized** finish provides a protective layer against corrosion and slightly improves radiant heat transfer. * **pushPIN™ Attachment:** This model uses a mechanical mounting system consisting of a pin and spring. This ensures consistent pressure between the heat sink and the chip, which is critical for thermal performance. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the device moves heat away from the component. Lower values are better. * **@ 1.0 m/s (200 LFM):** 4.05 °C/W * **@ 2.0 m/s (400 LFM):** 2.59 °C/W * **@ 3.0 m/s (600 LFM):** 2.15 °C/W --- ### 4. Application and Compatibility This part is typically used for cooling: * **Processors (CPUs/GPUs):** Small form factor chips. * **FPGAs & ASICs:** High-speed logic devices that generate significant heat. * **Telecommunications Equipment:** Where reliable, long-term cooling is required in enclosed rack systems. ---