The **ATS-13F-149-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed specifically for cooling electronic components like BGA (Ball Grid Array) packages. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-13F-149-C2-R0 | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 6.22°C/W (at 1.0 m/s airflow) | | **Dimensions** | 35.00mm x 35.00mm x 20.00mm | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (maxiFLOW™ Design) The "maxiFLOW" geometry features a spread fin structure. This design increases the surface area while reducing pressure drop, which allows for maximum heat dissipation in environments with constrained airflow. #### 2. Push-Pin Mounting System Instead of using messy thermal adhesives or tapes, this model uses a **Brass Push-Pin** with a steel spring. * **Benefits:** Ensures consistent pressure (clamped force) across the component for better thermal contact. * **Reliability:** It is more secure than adhesive in high-vibration environments. #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **SAINT-GOBAIN C700** or a similar high-performance thermal phase-change material. This fills the microscopic air gaps between the chip and the heat sink. #### 4. Material and Finish * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Black Anodized Finish:** Improves "emissivity," which helps the component radiate heat more effectively into the surrounding air. --- ### Performance Data (Airflow) | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.22 | | 400 | 2.0 | 4.85 | | 600 | 3.0 | 4.10 | --- ### Applications * **Network Switches/Routers:** Cooling high-speed processors. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where fans might be small or absent.