ATS-13F-142-C2-R0
AI

The **ATS-13F-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Fin Type** | Fine-Pitch (Straight) |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | 4.72°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 30.00mm x 30.00mm |
| **Height** | 15.00mm |
| **Finish** | Blue Anodized |
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### 2. Key Features and Components
#### A. Attachment Mechanism (pushPIN™)
The part number uses a specialized **push-pin** system. This consists of a plastic or metal pin and a spring.
* **Purpose:** It ensures constant pressure (clamping force) between the heat sink and the chip.
* **Reliability:** This is more secure than thermal adhesive tapes, especially in environments subject to vibration.
#### B. Material and Coating
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** The anodized layer provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer.
#### C. Fin Geometry
The "Fine-Pitch" design maximizes the surface area available for air interaction. This makes the ATS-13F-142-C2-R0 ideal for **forced convection** environments (systems with fans).
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### 3. Part Number Breakdown (Nomenclature)
Understanding the alphanumeric code helps in identifying variations:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) |
| **13F** | Heat Sink Series (pushPIN™) |
| **142** | Specific design/dimensions identifier |
| **C2** | Thermal Interface Material (Typically indicates pre-applied Phase Change Material) |
| **R0** | RoHS Compliant status / Revision code |
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### 4. Thermal Performance Data
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
* **Unducted Flow (100 LFM):** ~4.72 °C/W
* **Unducted Flow (500 LFM):** ~2.31 °C/W
* **Unducted Flow (700 LFM):** ~1.98 °C/W
*Note: A lower °C/W value indicates better heat dissipation efficiency.*
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What are the compatible PCB hole patterns for the push-pin attachment?
- ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM)?
- ⤷ How does the 'Fine-Pitch' fin design compare to 'Cross-Cut' designs in terms of airflow?