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  • ATS-13F-142-C2-R0

  • AI
    The **ATS-13F-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Fin Type** | Fine-Pitch (Straight) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 4.72°C/W (at 100 LFM) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Finish** | Blue Anodized | --- ### 2. Key Features and Components #### A. Attachment Mechanism (pushPIN™) The part number uses a specialized **push-pin** system. This consists of a plastic or metal pin and a spring. * **Purpose:** It ensures constant pressure (clamping force) between the heat sink and the chip. * **Reliability:** This is more secure than thermal adhesive tapes, especially in environments subject to vibration. #### B. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The anodized layer provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### C. Fin Geometry The "Fine-Pitch" design maximizes the surface area available for air interaction. This makes the ATS-13F-142-C2-R0 ideal for **forced convection** environments (systems with fans). --- ### 3. Part Number Breakdown (Nomenclature) Understanding the alphanumeric code helps in identifying variations: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **13F** | Heat Sink Series (pushPIN™) | | **142** | Specific design/dimensions identifier | | **C2** | Thermal Interface Material (Typically indicates pre-applied Phase Change Material) | | **R0** | RoHS Compliant status / Revision code | --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): * **Unducted Flow (100 LFM):** ~4.72 °C/W * **Unducted Flow (500 LFM):** ~2.31 °C/W * **Unducted Flow (700 LFM):** ~1.98 °C/W *Note: A lower °C/W value indicates better heat dissipation efficiency.*
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the push-pin attachment?
    • ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM)?
    • ⤷ How does the 'Fine-Pitch' fin design compare to 'Cross-Cut' designs in terms of airflow?