### Overview of ATS-13F-129-C2-R0 The **ATS-13F-129-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink designed for cooling integrated circuits (ICs), such as processors, FPGAs, and ASICs. --- ### Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Thermal Resistance (Flowing)** | 1.15 °C/W (@ 200 LFM) | | **Thermal Resistance (Static)** | 2.86 °C/W | | **Fin Style** | Fine Pitch (Rectangular) | --- ### Key Electronic & Physical Components #### 1. Heat Sink Body The part is made of **Aluminum 6063**, which offers high thermal conductivity. The "C2" in the part number indicates a **Blue Anodized** finish, which increases surface emissivity and provides corrosion resistance. #### 2. pushPIN™ Attachment System Instead of using messy adhesives or weak tape, this part uses a mechanical push-pin system. This ensures: * **Constant Pressure:** The springs maintain uniform contact between the heat sink and the chip. * **Reliability:** It is more resistant to vibration and thermal expansion than adhesive-based solutions. #### 3. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the heat sink comes with a **pre-applied Thermal Interface Material** (usually a high-performance phase-change material or grease). This eliminates the air gap between the component and the heat sink, significantly improving heat transfer. --- ### Performance Data Thermal management is measured by how effectively the part dissipates heat under different airflow conditions (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | |:---|:---|:---| | 100 | 0.5 | 2.86 | | 200 | 1.0 | 1.15 | | 400 | 2.0 | 0.82 | | 600 | 3.0 | 0.69 | --- ### Application Usage This part is commonly used in: * **Telecommunications:** High-speed routers and switches. * **Computing:** Server motherboards and GPU cooling. * **Industrial:** Control systems where airflow is directed through a chassis.