ATS-13F-124-C2-R0
AI

The **ATS-13F-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the key physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Type** | Push Pin (Spring Loaded) |
| **Thermal Resistance** | 3.28°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 50.00mm x 50.00mm |
| **Height** | 25.00mm |
| **Fin Style** | Straight Fin |
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### 2. Design and Composition
The part is engineered to maximize heat dissipation while maintaining a compact footprint on the PCB.
* **Heat Sink Material:** Extruded aluminum is used for its excellent thermal conductivity-to-weight ratio.
* **Fin Configuration:** It uses a straight-fin design, which is optimized for airflow provided by a system fan (forced convection).
* **Surface Treatment:** The "Blue Anodized" finish provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer.
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### 3. Attachment Mechanism (pushPIN™)
One of the most critical aspects of this part is the **Push Pin** mounting system.
* **Secure Fit:** Uses a flexible spring-loaded pin that passes through pre-drilled holes in the PCB.
* **Consistent Pressure:** The spring ensures that the heat sink maintains constant pressure against the electronic component, which is vital for the efficiency of the **Thermal Interface Material (TIM)**.
* **Quick Installation:** Allows for tool-free or rapid assembly on production lines.
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### 4. Part Number Breakdown
The nomenclature follows a specific pattern for Advanced Thermal Solutions:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Brand) |
| **13F** | Series designation / Pin type |
| **124** | Specific dimension/fin geometry code |
| **C2** | Thermal Interface Material (usually T766 phase change) |
| **R0** | Revision / Finish code (Blue Anodize) |
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- ⤷
What are the compatible PCB hole patterns for the pushPIN system used in this part?
- ⤷ How does the thermal resistance of this heat sink change at higher airflow speeds (LFM)?
- ⤷ Is a pre-applied Thermal Interface Material (TIM) included with the C2 variant?