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  • ATS-13F-124-C2-R0

  • AI
    The **ATS-13F-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the key physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push Pin (Spring Loaded) | | **Thermal Resistance** | 3.28°C/W (at 100 LFM) | | **Dimensions (L x W)** | 50.00mm x 50.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight Fin | --- ### 2. Design and Composition The part is engineered to maximize heat dissipation while maintaining a compact footprint on the PCB. * **Heat Sink Material:** Extruded aluminum is used for its excellent thermal conductivity-to-weight ratio. * **Fin Configuration:** It uses a straight-fin design, which is optimized for airflow provided by a system fan (forced convection). * **Surface Treatment:** The "Blue Anodized" finish provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. --- ### 3. Attachment Mechanism (pushPIN™) One of the most critical aspects of this part is the **Push Pin** mounting system. * **Secure Fit:** Uses a flexible spring-loaded pin that passes through pre-drilled holes in the PCB. * **Consistent Pressure:** The spring ensures that the heat sink maintains constant pressure against the electronic component, which is vital for the efficiency of the **Thermal Interface Material (TIM)**. * **Quick Installation:** Allows for tool-free or rapid assembly on production lines. --- ### 4. Part Number Breakdown The nomenclature follows a specific pattern for Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **13F** | Series designation / Pin type | | **124** | Specific dimension/fin geometry code | | **C2** | Thermal Interface Material (usually T766 phase change) | | **R0** | Revision / Finish code (Blue Anodize) | ---
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the pushPIN system used in this part?
    • ⤷ How does the thermal resistance of this heat sink change at higher airflow speeds (LFM)?
    • ⤷ Is a pre-applied Thermal Interface Material (TIM) included with the C2 variant?