ATS-13F-121-C2-R0
AI

The **ATS-13F-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, or power modules that require efficient heat dissipation.
### 1. Technical Specifications
The part belongs to the **pushPIN™** series, which uses a specialized attachment mechanism for secure mounting.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Fin Type** | Fine-Pitch (Cross-Cut) |
| **Thermal Resistance** | 9.48°C/W (at 100 LFM) |
| **Attachment Method** | Push-pin with Spring |
| **Dimensions** | 45mm x 45mm x 30mm |
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### 2. Physical Design & Composition
The "electronic parts" of this assembly are purely mechanical and thermal in nature:
* **Heat Sink Body:** Extruded aluminum with a high surface-area-to-volume ratio. The cross-cut fin design allows for airflow from multiple directions, making it versatile for different PCB layouts.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a high-performance thermal grease to ensure maximum heat transfer between the component and the heat sink.
* **Attachment Hardware:**
* **Push-pins:** Usually made of nylon or brass.
* **Springs:** Compression springs ensure constant, even pressure on the component to prevent air gaps.
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### 3. Thermal Performance Metrics
Thermal resistance indicates how efficiently the heat sink moves heat away from the silicon. Lower values are better.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 9.48 |
| 300 (1.5 m/s) | 4.47 |
| 500 (2.5 m/s) | 3.25 |
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### 4. Key Advantages
* **High Aspect Ratio:** Optimized for compact spaces while maintaining high cooling capacity.
* **Mechanical Stability:** The push-pin system provides a more secure fit than adhesive tapes, especially in environments with high vibration.
* **RoHS Compliant:** The blue anodized finish and aluminum alloy meet environmental standards for hazardous substances.
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What is the difference between push-pin and adhesive mounting for heat sinks?
- ⤷ How do I calculate the required LFM for my specific processor?
- ⤷ Are there alternative fin designs for low-airflow environments?