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  • ATS-13F-121-C2-R0

  • AI
    The **ATS-13F-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, or power modules that require efficient heat dissipation. ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which uses a specialized attachment mechanism for secure mounting. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Fin Type** | Fine-Pitch (Cross-Cut) | | **Thermal Resistance** | 9.48°C/W (at 100 LFM) | | **Attachment Method** | Push-pin with Spring | | **Dimensions** | 45mm x 45mm x 30mm | --- ### 2. Physical Design & Composition The "electronic parts" of this assembly are purely mechanical and thermal in nature: * **Heat Sink Body:** Extruded aluminum with a high surface-area-to-volume ratio. The cross-cut fin design allows for airflow from multiple directions, making it versatile for different PCB layouts. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a high-performance thermal grease to ensure maximum heat transfer between the component and the heat sink. * **Attachment Hardware:** * **Push-pins:** Usually made of nylon or brass. * **Springs:** Compression springs ensure constant, even pressure on the component to prevent air gaps. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the heat sink moves heat away from the silicon. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.48 | | 300 (1.5 m/s) | 4.47 | | 500 (2.5 m/s) | 3.25 | --- ### 4. Key Advantages * **High Aspect Ratio:** Optimized for compact spaces while maintaining high cooling capacity. * **Mechanical Stability:** The push-pin system provides a more secure fit than adhesive tapes, especially in environments with high vibration. * **RoHS Compliant:** The blue anodized finish and aluminum alloy meet environmental standards for hazardous substances.
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and adhesive mounting for heat sinks?
    • ⤷ How do I calculate the required LFM for my specific processor?
    • ⤷ Are there alternative fin designs for low-airflow environments?