The **ATS-13F-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series designed for cooling electronic integrated circuits (ICs). --- ### 1. Technical Specifications Below are the key electronic and physical specifications for this part: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13F-101-C2-R0 | | **Material** | Aluminum (AL6063) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight (Fine Pitch) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Fin Finish** | Blue Anodized | | **TIM (Thermal Interface Material)** | T766 (High Performance) | --- ### 2. Component Dimensions Precise physical sizing is critical for ensuring clearance on a Printed Circuit Board (PCB). * **Width/Length:** 45.00 mm x 45.00 mm * **Height:** 30.00 mm (Off the PCB) * **Pitch (Mounting):** 38.00 mm --- ### 3. Key Electronic Features * **Thermal Efficiency:** This heat sink is engineered for high-density electronic packaging. The "C2" designation refers to the specific blue anodized finish and thermal performance rating. * **Push-Pin Attachment:** Instead of using adhesives or solder, this uses a spring-loaded push-pin mechanism. This provides constant pressure (preload) for better thermal contact and allows for easy removal/rework without damaging the PCB. * **Pre-applied TIM:** It comes with **T766** thermal interface material already applied to the base, ensuring consistent heat transfer from the processor or component to the aluminum fins. --- ### 4. Typical Applications This part is commonly used to cool the following electronic components: 1. **CPUs and GPUs:** Medium-power embedded processors. 2. **FPGAs (Field Programmable Gate Arrays):** High-speed logic chips that generate significant heat. 3. **ASICs:** Application-specific integrated circuits in networking or telecommunications equipment.