The **ATS-13D-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications Below is the technical breakdown of the part based on its manufacturer specifications: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 20.30°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Compatibility** | Universal (Standard PCB hole patterns) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System This part utilizes the proprietary **pushPIN™** system. Instead of using messy adhesives or complicated screw mounts, it uses a spring-loaded pin mechanism. * **Benefit:** Provides consistent pressure across the thermal interface material (TIM), ensuring optimal heat transfer. * **Reliability:** Reusable and prevents over-tightening which could damage the PCB. ### B. Material and Coating * **Aluminum Construction:** Offers a balance between weight, cost, and thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity and protects the aluminum from corrosion. ### C. Low Profile Design With a height of only **10.00mm**, this heat sink is considered "low profile." It is ideal for space-constrained applications like: * 1U Servers. * Embedded computing boards. * Small Form Factor (SFF) workstations. --- ## 3. Thermal Performance (Deg C/W) The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 20.30 | 8.90 | 5.30 | 4.10 | *Note: Higher airflow significantly reduces thermal resistance, meaning the device stays much cooler under active fan cooling.* --- ## 4. Part Number Breakdown (Nomenclature) The part number **ATS-13D-97-C2-R0** follows a specific logic: * **ATS:** Manufacturer prefix. * **13:** Series/Attachment type. * **D:** Pin material/configuration. * **97:** Specific geometry/dimension code. * **C2:** Thermal Interface Material (TIM) type (usually T766 phase-change material). * **R0:** Revision/Packaging code.