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  • ATS-13D-95-C2-R0

  • AI
    The **ATS-13D-95-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power chipsets. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-13D-95-C2-R0 | | **Heat Sink Type** | Push-pin (Spring Loaded) | | **Base Material** | Aluminum | | **Fin Style** | Straight | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 7.29°C/W (Unducted @ 200 LFM) | | **Attachment Method** | Plastic Push-Pin with Brass Springs | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Physical Design Features * **Heat Sink Body:** Constructed from high-grade aluminum to balance weight and thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves emissivity. * **Straight Fin Pattern:** The "Straight" fin geometry is optimized for vertical or horizontal airflow. These fins provide a large surface area for heat exchange with the surrounding air. * **Push-Pin Mounting:** This model uses a tool-less attachment system. The plastic pins compress a spring against the PCB to ensure consistent pressure between the heat sink and the chip, which is critical for heat transfer. --- ### 3. Thermal Performance Metrics The cooling efficiency depends on the air velocity (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 7.29 | | 400 (2.0 m/s) | 3.00 | | 600 (3.0 m/s) | 2.13 | --- ### 4. Integration Considerations * **Footprint:** Ensure the PCB has the correct hole pattern for the 40mm x 40mm footprint. * **Component Height:** With a 20mm height, it is suitable for 1U or 2U chassis depending on the internal layout. * **TIM Replacement:** The unit comes with **T766** thermal grease pre-applied. If the heat sink is removed during maintenance, this material must be cleaned off and replaced to maintain thermal performance.
    ✨ Follow-up Questions
    • ⤷What is the hole-to-hole spacing required for this push-pin mounting?
    • ⤷ How does T766 thermal interface material compare to high-end thermal pastes?
    • ⤷ What are the advantages of blue anodized finishes in electronics?