ATS-13D-95-C2-R0
AI

The **ATS-13D-95-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power chipsets.
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### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-13D-95-C2-R0 |
| **Heat Sink Type** | Push-pin (Spring Loaded) |
| **Base Material** | Aluminum |
| **Fin Style** | Straight |
| **Dimensions (L x W x H)** | 40mm x 40mm x 20mm |
| **Thermal Resistance** | 7.29°C/W (Unducted @ 200 LFM) |
| **Attachment Method** | Plastic Push-Pin with Brass Springs |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### 2. Physical Design Features
* **Heat Sink Body:** Constructed from high-grade aluminum to balance weight and thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves emissivity.
* **Straight Fin Pattern:** The "Straight" fin geometry is optimized for vertical or horizontal airflow. These fins provide a large surface area for heat exchange with the surrounding air.
* **Push-Pin Mounting:** This model uses a tool-less attachment system. The plastic pins compress a spring against the PCB to ensure consistent pressure between the heat sink and the chip, which is critical for heat transfer.
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### 3. Thermal Performance Metrics
The cooling efficiency depends on the air velocity (LFM - Linear Feet per Minute):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 7.29 |
| 400 (2.0 m/s) | 3.00 |
| 600 (3.0 m/s) | 2.13 |
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### 4. Integration Considerations
* **Footprint:** Ensure the PCB has the correct hole pattern for the 40mm x 40mm footprint.
* **Component Height:** With a 20mm height, it is suitable for 1U or 2U chassis depending on the internal layout.
* **TIM Replacement:** The unit comes with **T766** thermal grease pre-applied. If the heat sink is removed during maintenance, this material must be cleaned off and replaced to maintain thermal performance.
- ⤷What is the hole-to-hole spacing required for this push-pin mounting?
- ⤷ How does T766 thermal interface material compare to high-end thermal pastes?
- ⤷ What are the advantages of blue anodized finishes in electronics?