The **ATS-13D-87-C2-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 12.7mm | | **Attachment Method** | pushPIN™ (Brass pins) | | **Thermal Resistance** | 13.12 °C/W @ 100 LFM | | **Fin Style** | straight-fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. maxiFLOW™ Design The heat sink features a "spread fin" geometry. Unlike standard straight-fin heat sinks, the fins flare outward. This design: * Reduces pressure drop. * Increases surface area for convection. * Maximizes airflow through the fin field. ### B. pushPIN™ Attachment Instead of using messy adhesives or weak thermal tape, this part uses a **pushPIN™** system. This consists of: * **Brass Pins:** Provide a secure, vibration-resistant mechanical connection to the PCB. * **Compression Springs:** Ensure consistent pressure between the heat sink and the electronic component for optimal heat transfer. ### C. Thermal Interface Material (TIM) The **C2** in the part number indicates the specific TIM used. * **T766:** This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink base. * **R0:** This suffix indicates compliance with **RoHS** (Restriction of Hazardous Substances) standards. --- ## 3. Common Applications This heat sink is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs or power regulators. 4. **Computing:** Chipset cooling on motherboards. ---