The **ATS-13D-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin style heat sink series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13D-80-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass, 2-Piece) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Fin Style** | Straight Fin | --- ### 2. Key Design Features * **Attachment Mechanism:** It uses a push-pin and spring mechanism. This provides high reliability and consistent pressure on the electronic component, which improves heat transfer compared to adhesive tapes. * **Material and Finish:** The aluminum construction offers a lightweight profile with high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it improves surface emissivity and protects against corrosion. * **Thermal Interface Material (TIM):** This model comes pre-applied with **T766**, a specialized thermal paste/pad that fills microscopic air gaps between the heat sink and the component, significantly lowering thermal resistance. * **Fin Geometry:** The straight fin design is optimized for environments where there is a consistent directional airflow (forced convection), allowing air to flow through the channels efficiently. --- ### 3. Thermal Performance (Estimated) The "C2" in the part number indicates a specific performance tier within the ATS product line. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | ~7.05 | | 200 (1.0 m/s) | ~3.90 | | 400 (2.0 m/s) | ~2.60 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling processors in industrial computers. * **Networking Gear:** Switches and routers where internal airflow is managed. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators. * **Telecommunications:** High-speed data processing units.