The **ATS-13D-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-13D-75-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.57°C/W (at 200 LFM) | | **Dimensions** | 25mm x 25mm x 30mm | | **Thermal Interface Material** | T412 (Pre-applied phase change material) | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System The "R0" at the end of the part number signifies the use of the **pushPIN™** system. This consists of: * **Flexible Springs:** Provide a precise amount of pressure (compression) to ensure optimal contact between the heat sink and the component. * **Plastic/Brass Push Pins:** Secure the heat sink directly into pre-drilled holes on the PCB (Printed Circuit Board). #### B. Cross-Cut Fin Design The fins on this model are "cross-cut," creating a grid of pins. * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, this design allows air to flow through the fins from any direction, making it ideal for enclosures with complex airflow patterns. * **Increased Surface Area:** Maximizes the area available for convection cooling. #### C. Thermal Interface Material (TIM) The base of the heat sink comes pre-applied with **T412**. This is a high-performance thermal pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance compared to air. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify its specific electronic properties: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **13D:** Specific product series/family. * **75:** Physical dimension code. * **C3:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision and Attachment type. --- ### 4. Application Use-Cases * **Embedded Systems:** Used on small-form-factor boards where space is tight. * **Telecommunications:** Cooling high-speed data processing chips. * **Power Supplies:** Managing heat in voltage regulators or MOSFETs. ---