ATS-13D-69-C2-R0
AI

The **ATS-13D-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin attachment series designed for cooling electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
Below are the primary technical attributes of the ATS-13D-69-C2-R0:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 11.31°C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Components & Features
#### A. The Fin Design (Straight Fin)
The "Straight Fin" geometry is optimized for **forced-air cooling** (fan-driven systems). The vertical fins provide a large surface area to dissipate heat as air flows through the channels.
#### B. Attachment Mechanism (Push-Pins)
Instead of using messy adhesives or permanent solder, this part uses a **Brass Push-Pin** system.
* **Reliability:** Ensures consistent pressure across the component surface.
* **Reusability:** Can be removed for maintenance without damaging the PCB.
* **Springs:** Uses compression springs to maintain a precise "clamping force."
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base.
* **Function:** It fills microscopic air gaps between the heat sink and the electronic chip.
* **Benefit:** Reduces contact resistance and ensures maximum heat transfer efficiency.
#### D. Material and Coating
* **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just for aesthetics; it provides corrosion resistance and slightly increases the emissivity of the surface, aiding in heat radiation.
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### 3. Application Use Cases
The ATS-13D-69-C2-R0 is typically used in environments where PCB space is at a premium but high thermal dissipation is required:
* **Telecommunications:** Networking switches and routers.
* **Industrial PC:** Embedded systems and industrial controllers.
* **Power Supplies:** Cooling high-wattage voltage regulators.
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### 4. Part Number Breakdown
The nomenclature follows a specific logic:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **13:** Series number.
* **D:** Attachment type/Hardware variation.
* **69:** Specific size/footprint code.
* **C2:** Material/Finish code (Blue Anodized Aluminum).
* **R0:** Revision or Packaging code.
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What is the significance of the 'T766' thermal interface material compared to others?
- ⤷ How do I calculate if this heat sink is sufficient for a 15W component?
- ⤷ Are there specific PCB hole diameter requirements for the brass push-pins?