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  • ATS-13D-69-C2-R0

  • AI
    The **ATS-13D-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin attachment series designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications Below are the primary technical attributes of the ATS-13D-69-C2-R0: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 11.31°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Features #### A. The Fin Design (Straight Fin) The "Straight Fin" geometry is optimized for **forced-air cooling** (fan-driven systems). The vertical fins provide a large surface area to dissipate heat as air flows through the channels. #### B. Attachment Mechanism (Push-Pins) Instead of using messy adhesives or permanent solder, this part uses a **Brass Push-Pin** system. * **Reliability:** Ensures consistent pressure across the component surface. * **Reusability:** Can be removed for maintenance without damaging the PCB. * **Springs:** Uses compression springs to maintain a precise "clamping force." #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** Reduces contact resistance and ensures maximum heat transfer efficiency. #### D. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; it provides corrosion resistance and slightly increases the emissivity of the surface, aiding in heat radiation. --- ### 3. Application Use Cases The ATS-13D-69-C2-R0 is typically used in environments where PCB space is at a premium but high thermal dissipation is required: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Embedded systems and industrial controllers. * **Power Supplies:** Cooling high-wattage voltage regulators. --- ### 4. Part Number Breakdown The nomenclature follows a specific logic: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **13:** Series number. * **D:** Attachment type/Hardware variation. * **69:** Specific size/footprint code. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision or Packaging code.
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'T766' thermal interface material compared to others?
    • ⤷ How do I calculate if this heat sink is sufficient for a 15W component?
    • ⤷ Are there specific PCB hole diameter requirements for the brass push-pins?