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  • ATS-13D-65-C2-R0

  • AI
    The **ATS-13D-65-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight (optimized for airflow) | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | --- ### 2. Key Components and Features #### A. Thermal Interface Material (TIM) * **Pre-Applied:** This model typically comes with a pre-applied high-performance thermal interface material (T605 or similar). * **Function:** It fills microscopic air gaps between the heat source and the aluminum base to maximize heat transfer efficiency. #### B. The pushPIN™ System Unlike adhesive-based heat sinks, this part uses a mechanical fastening system: * **Compression Springs:** Provide a precise, consistent amount of pressure on the component to prevent damage while ensuring thermal contact. * **Push-pins:** These insert into pre-drilled holes on the PCB (Printed Circuit Board). #### C. Fin Design * **Geometry:** The straight-fin design is engineered for specific airflow directions. * **Efficiency:** The 20mm height offers a balance between surface area for heat dissipation and clearance for surrounding low-profile electronic components. --- ### 3. Electronic Application The ATS-13D-65-C2-R0 is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. 3. **Industrial Computing:** Maintaining stable temperatures for embedded controllers in harsh environments. --- ### 4. Part Number Breakdown (Decoding) ```text ATS - 13 D - 65 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Finish (Blue Anodized) | | | +------------ Thermal Performance Code | | +----------------- Attachment Type (pushPIN) | +------------------- Fin Profile/Size Code +------------------------- Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ How does the thermal resistance of this part change with different airflow (LFM) speeds?
    • ⤷ Is this heat sink compatible with standard BGA or LGA packages?