ATS-13D-65-C2-R0
AI

The **ATS-13D-65-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Property | Details |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Fin Type** | Straight (optimized for airflow) |
| **Attachment Method** | pushPIN™ (Spring-loaded attachment) |
| **Thermal Resistance** | 7.29 °C/W (at 100 LFM) |
| **Dimensions** | 45mm x 45mm x 20mm |
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### 2. Key Components and Features
#### A. Thermal Interface Material (TIM)
* **Pre-Applied:** This model typically comes with a pre-applied high-performance thermal interface material (T605 or similar).
* **Function:** It fills microscopic air gaps between the heat source and the aluminum base to maximize heat transfer efficiency.
#### B. The pushPIN™ System
Unlike adhesive-based heat sinks, this part uses a mechanical fastening system:
* **Compression Springs:** Provide a precise, consistent amount of pressure on the component to prevent damage while ensuring thermal contact.
* **Push-pins:** These insert into pre-drilled holes on the PCB (Printed Circuit Board).
#### C. Fin Design
* **Geometry:** The straight-fin design is engineered for specific airflow directions.
* **Efficiency:** The 20mm height offers a balance between surface area for heat dissipation and clearance for surrounding low-profile electronic components.
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### 3. Electronic Application
The ATS-13D-65-C2-R0 is commonly used in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed network processors.
2. **Power Supplies:** Heat dissipation for MOSFETs and power regulators.
3. **Industrial Computing:** Maintaining stable temperatures for embedded controllers in harsh environments.
---
### 4. Part Number Breakdown (Decoding)
```text
ATS - 13 D - 65 - C2 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Finish (Blue Anodized)
| | | +------------ Thermal Performance Code
| | +----------------- Attachment Type (pushPIN)
| +------------------- Fin Profile/Size Code
+------------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ How does the thermal resistance of this part change with different airflow (LFM) speeds?
- ⤷ Is this heat sink compatible with standard BGA or LGA packages?