The **ATS-13D-52-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "pushPIN™" thermal management line. --- ### 1. Technical Specifications This component is designed to dissipate heat from surface-mount devices like CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-13D-52-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 10.79°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 25.00mm | --- ### 2. Key Design Elements #### A. Fin Profile (Fine-Pitch Design) The "52" series features a **Straight-Fin** design. This allows for excellent airflow efficiency in both natural convection and forced-air cooling environments. #### B. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Compression Spring:** Provides precise, uniform pressure across the thermal interface material (TIM). * **Plastic Pins:** These snap into pre-drilled holes on the PCB (usually 3mm diameter), ensuring the heat sink remains secure even under high vibration. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with a high-performance thermal interface material (like T766) to ensure a low thermal resistance path between the chip and the aluminum fins. --- ### 3. Environmental and Compliance The component is designed for industrial and commercial reliability: * **RoHS Status:** Compliant (Lead-free). * **REACH Status:** Compliant. * **Durability:** The Blue Anodized finish provides surface protection and slightly improves radiation heat transfer. --- ### 4. Application Use Cases * **Telecommunications:** Cooling of networking chips. * **Embedded Systems:** High-heat processors in small form factors. * **Power Supplies:** Dissipating heat from voltage regulators.