The **ATS-13D-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of Component Parts The assembly is comprised of four main electronic/mechanical elements: 1. **The Heat Sink Body:** Made from aluminum for high thermal conductivity. The blue anodized finish provides corrosion resistance and increased emissivity. 2. **Push-Pins:** These are brass components that pass through pre-drilled holes in the PCB. They allow for tool-free installation and consistent pressure. 3. **Compression Springs:** Located on the push-pins, these ensure that the heat sink maintains firm, constant contact with the heat-generating component (like a BGA or CPU) to prevent air gaps. 4. **Thermal Interface Material (TIM):** The "C2" in the part number indicates the use of **T766 phase-change material**. This fills microscopic gaps between the chip and the heat sink to maximize heat transfer. --- ### 3. Part Number Decoding Understanding the nomenclature helps in identifying the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **13D** | Series / Product Family (Push-Pin type) | | **33** | Dimension Code (35mm x 35mm) | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications This part is commonly used to cool high-heat electronic components such as: * **Field Programmable Gate Arrays (FPGAs)** * **Application Specific Integrated Circuits (ASICs)** * **Microprocessors/CPUs** * **Northbridge/Southbridge Chipsets**