The **ATS-13B-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 11.51°C/W (Natural Convection) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Application This part is used to dissipate heat from integrated circuits (ICs) that generate significant thermal energy during operation. Common applications include: * **CPUs/GPUs:** Small form factor processors. * **ASICs:** Application-specific chips in networking gear. * **Power Semiconductors:** Transistors and MOSFETs that require passive cooling to prevent thermal throttling or damage. --- ### 3. Key Components of the Assembly The assembly consists of three primary electronic packaging elements: 1. **Heat Sink Body:** The aluminum fins increase the surface area to allow air to carry away heat. 2. **Push-Pin Mechanism:** A spring-loaded fastener that ensures constant pressure (clamping force) against the electronic component for maximum heat transfer. 3. **Thermal Interface Material (TIM):** This part usually comes with **ATS-PPS-13** (or similar) pre-applied or recommended, filling microscopic air gaps between the chip and the metal. --- ### 4. Thermal Performance Map Thermal resistance varies based on airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.03 | | 300 | 1.5 | 2.11 | | 500 | 2.5 | 1.59 | ---