The **ATS-13B-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-13B-83-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Height Off Base)** | 20.00 mm | | **Fin Pitch** | Fine-Pitch | | **Fin Pattern** | Straight | --- ### 2. Thermal Performance Data Thermal resistance is measured based on the velocity of airflow (LFM - Linear Feet per Minute). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 8.57 | | 200 (1.0 m/s) | 3.13 | | 300 (1.5 m/s) | 2.02 | | 400 (2.0 m/s) | 1.62 | | 500 (2.5 m/s) | 1.41 | --- ### 3. Key Electronic/Mechanical Features * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** (a high-performance thermal grease) or similar, ensuring immediate contact efficiency between the heat sink and the component (CPU, GPU, or FPGA). * **pushPIN™ Attachment:** Instead of messy adhesives, it uses a brass or plastic pin with a stainless steel spring. This provides a precise "clamping force" (measured in PSI) required for optimal thermal transfer without cracking the silicon die. * **Cross-Cut/Straight Fin Design:** The fin geometry is optimized for high-density boards where airflow might be restricted, ensuring maximum surface area in a small footprint. ### 4. Application Use Cases This part is commonly used to cool: 1. **High-speed Networking Chips** (Switches/Routers). 2. **Power Supplies** (VRMs/MOSFETs). 3. **Embedded Systems** where vertical space is limited to 20mm. ---