The part number **ATS-13B-65-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue" push-pin heat sink series, designed specifically for cooling electronic components like BGA (Ball Grid Array) processors. --- ### 1. Technical Specifications The table below breaks down the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight (Vertical) | | **Attachment Method** | Push-Pin (with 2 holes) | | **Thermal Resistance** | 7.29°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied thermal pad/grease) | --- ### 2. Breakdown of the Part Number ATS uses a structured naming convention to define the part's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13B**: Series designation (Push-pin attachment style). * **65**: Dimensions code (Specific to the 45mm x 45mm footprint). * **C2**: Height/Color/Performance variant (C2 indicates high-performance fin geometry). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Functions While this is a mechanical part, its role in an electronic system is critical for reliability: 1. **Heat Dissipation:** It increases the surface area of a chip (CPU, GPU, or FPGA), allowing the surrounding air to carry away heat via convection. 2. **Thermal Protection:** By maintaining a lower junction temperature, it prevents **thermal throttling** (where a processor slows down to stay cool) and extends the lifespan of the semiconductor. 3. **Mechanical Stability:** The **Push-Pin** system uses a built-in spring mechanism to provide constant, even pressure on the chip. This ensures the Thermal Interface Material (TIM) fills all microscopic gaps between the chip and the sink. --- ### 4. Application Use Cases * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Cooling for high-speed routers and switches. * **Power Electronics:** Large MOSFET or IGBT modules that require dedicated cooling.