The **ATS-13B-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Fine-Pitch (Cross-Cut) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (H)** | 25.00 mm | | **Pitch (Spacing)** | 1.14 mm | --- ### 2. Core Electronic Functions In an electronic circuit, the ATS-13B-40-C2-R0 serves the following roles: * **Thermal Resistance Reduction:** It reduces the junction temperature ($T_j$) of semiconductors (CPUs, GPUs, FPGAs) by transferring heat to the surrounding air. * **Performance Stability:** By preventing thermal throttling, it ensures that electronic components can maintain their clock speeds and performance under load. * **Longevity:** Maintaining lower operating temperatures significantly extends the Mean Time Between Failures (MTBF) of sensitive electronic parts. --- ### 3. Thermal Performance (Flow Rates) The efficiency of this heat sink varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | @ 100 LFM (0.5 m/s) | 14.56 °C/W | 2.14 °C/W | | @ 300 LFM (1.5 m/s) | 4.80 °C/W | 1.35 °C/W | | @ 700 LFM (3.5 m/s) | 2.48 °C/W | 1.03 °C/W | --- ### 4. Mounting Mechanism The **"pushPIN™"** system is a mechanical mounting solution that includes: 1. **Spring-loaded Pins:** Provides consistent pressure across the interface to maximize thermal contact. 2. **Flexible Attachment:** Allows for easy installation and removal without the need for specialized tools in most cases. 3. **Pre-assembled Thermal Interface Material (TIM):** Usually comes with a pre-applied phase-change material or thermal grease for immediate deployment. ---