The part number **ATS-13B-101-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed for cooling electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Thermal Resistance (Convection)** | 6.77°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass pins/Steel springs) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Interface Material (TIM)** | T766 (High Performance Pre-applied) | --- ### 2. Design and Component Features The "Electronic" nature of this part lies in its mechanical design to dissipate heat from sensitive electronic circuits. * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered base and a high-aspect-ratio flare. This increases the surface area and encourages turbulent airflow, which is more effective at removing heat than laminar flow. * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical push-pin system. This ensures consistent pressure across the electronic chip, which is critical for maximizing the efficiency of the thermal interface. * **Thermal Interface Material (T766):** The base comes pre-coated with T766. This is a specialized material that fills microscopic air gaps between the heatsink and the electronic component, significantly reducing thermal impedance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **13B** | Series (maxiFLOW with pushPIN™) | | **101** | Size/Model reference | | **C3** | Thermal performance/Fin configuration class | | **R0** | RoHS Compliance / Revision code | --- ### 4. Applications This part is typically found in: 1. **Networking Hardware:** Routers, switches, and base stations. 2. **Industrial PCs:** Cooling embedded CPU modules. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.