The **ATS-12H-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other PCB-mounted components. ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flow)** | 6.69 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.20 °C/W @ 700 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Pitch/Fin Pattern** | Fine Pitch (Straight Fin) | --- ### 2. Design Features The part incorporates several engineering choices to optimize heat dissipation: * **Push-Pin Attachment:** Instead of using messy thermal adhesives or complex brackets, this part uses a plastic push-pin with a compression spring. This ensures consistent pressure between the heat sink and the chip, improving thermal transfer. * **High Aspect Ratio Fins:** The "101" series features a fine-pitch fin design. This increases the surface area exposed to the air, making it highly effective in systems with active airflow (fans). * **Pre-Applied TIM:** These units typically come with **T766 Phase Change Material** or similar thermal interface material pre-applied to the base, ensuring there are no air gaps between the component and the sink. --- ### 3. Dimensional Layout The part is designed for a specific footprint on a Printed Circuit Board (PCB): | Dimension Type | Metric Value | | :--- | :--- | | **Length (A)** | 45.00 mm | | **Width (B)** | 45.00 mm | | **Height (C)** | 30.00 mm | | **Hole Pattern (E)** | 38.00 mm | | **Hole Pattern (F)** | 38.00 mm | --- ### 4. Application Use Cases The **ATS-12H-101-C2-R0** is commonly found in: * **Networking Equipment:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and high-speed processors that generate significant waste heat in a localized area.