The **ATS-12F-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 7.00°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Design The "push-pin" series is characterized by its mechanical mounting system, which ensures consistent pressure and thermal contact. * **Push-Pin Mounting:** This part uses a spring-loaded push-pin mechanism. It requires pre-drilled holes in the PCB. The springs provide the necessary downward force to maintain high-quality contact between the heat sink base and the electronic chip. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a "Phase Change" material that softens when the component heats up, filling microscopic air gaps to improve heat transfer. * **Fin Geometry:** It features a "Cross-Cut" or straight fin design optimized for high-density airflow environments. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the alphanumeric code helps identify its specific properties: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **12F** | Series Identifier (Push-Pin Series) | | **84** | Specific sizing and fin configuration | | **C2** | Thermal Interface Material (TIM) and Finish Type | | **R0** | RoHS Compliance status / Revision | --- ### 4. Application Use-Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling of ASICs and FPGAs in network switches. 2. **Embedded Systems:** Industrial PCs where mechanical vibration resistance is required (due to the secure push-pin mount). 3. **Power Electronics:** Dissipating heat from voltage regulators or power modules.