The **ATS-12F-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure mounting on Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below are the key electronic and physical parameters for this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-12F-80-C2-R0 | | **Thermal Resistance** | 1.88°C/W @ 200 LFM (Linear Feet per Minute) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Fins** | High-density Fine Pitch (Square Pattern) | --- ### 2. Design and Construction This component is engineered to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. * **Heat Sink Material:** Made of Aluminum 6063, which offers high thermal conductivity while remaining lightweight. * **Fin Style:** It utilizes a **Fine-Pitch** design. This increases the total surface area available for air-to-metal contact, enhancing cooling efficiency in forced-air environments. * **Blue Anodized Coating:** The blue anodization is not just aesthetic; it provides surface protection against corrosion and slightly improves thermal emissivity. --- ### 3. Mounting and Interface The "electronic" security of the part relies on its mechanical attachment: 1. **Push-Pin Mechanism:** It uses a brass push-pin with a stainless steel spring. This provides a consistent, high-pressure force against the chip, ensuring optimal thermal contact. 2. **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** (a high-performance phase-change material) or similar, which fills microscopic air gaps between the IC and the heat sink. 3. **Hole Pattern:** Designed for specific PCB hole spacing (typically 20mm to 40mm depending on the exact sub-series) to prevent the sink from shifting during vibration or transport. --- ### 4. Thermal Performance Data Performance varies based on the airflow (velocity) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Static/Low)** | 7.01 | | **200 (Moderate)** | 1.88 | | **400 (High)** | 1.25 | | **600 (Extreme)** | 0.98 | ---