The **ATS-12F-75-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on a PCB. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 1.51°C/W (at 200 LFM) | | **Pressure Drop** | 0.12 in $H_2O$ (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Fin Type** | XC-Cut (Cross-cut) | --- ## 2. Component Breakdown ### A. Material and Coating The heat sink is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased surface emissivity for better radiation cooling. * Corrosion resistance. * Electrical insulation to prevent accidental shorts if it contacts traces. ### B. XC-Cut Fin Design The "XC-Cut" refers to a cross-cut pattern in the fins. Unlike straight fins, this design: * Allows for **omni-directional airflow**, meaning the air can enter from any side. * Increases the surface area relative to the volume. * Is ideal for systems where the direction of the internal cooling fan is not perfectly aligned with the heat sink. ### C. Attachment System (Push-Pin) This model utilizes a **Plastic Push-Pin** with a **Brass Spring**. * **Ease of Assembly:** It allows for quick tool-less or low-tool installation. * **Interface Pressure:** The spring ensures consistent pressure between the heat sink base and the electronic chip, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM). --- ## 3. Thermal Interface Material (TIM) The part number indicates it comes pre-applied with **T412 Phase Change Material**. * **Function:** It fills microscopic air gaps between the chip and the heat sink. * **Performance:** Phase change materials soften at operating temperatures to create a very thin, high-performance thermal bond. --- ## 4. Part Number Decoder Understanding the "ATS-12F-75-C3-R0" nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **12F** | Series/Internal Design Code | | **75** | Specific Geometry/Fin Profile | | **C3** | Attachment/Spring Tension Code | | **R0** | Revision/Packaging Code |