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  • ATS-12F-75-C1-R0

  • AI
    The part number **ATS-12F-75-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series, designed primarily for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table breaks down the technical characteristics of the ATS-12F-75-C1-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | Variable (based on Airflow) | | **Dimensions (L x W x H)** | 45.0mm x 45.0mm x 10.0mm | | **Pressure Spring** | Stainless Steel (R0 series) | | **Thermal Interface Material** | T766 (High Performance Phase Change) | --- ### 2. Detailed Breakdown of Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **12**: Designates the specific product family/series. * **F**: Denotes the Fin pitch or spacing (e.g., Fine). * **75**: Denotes the specific length/width configuration (45mm x 45mm). * **C1**: Refers to the height of the heat sink (10mm). * **R0**: Indicates the specific thermal interface material (T766) and the attachment hardware package. --- ### 3. Key Electronic Cooling Features * **High Performance:** The straight fin design is optimized for high-density airflow environments, ensuring maximum surface area for heat dissipation. * **Integrated Thermal Interface (TIM):** This model comes pre-applied with **T766 phase-change material**. This eliminates the need for manual paste application and ensures uniform heat transfer between the chip and the aluminum. * **Mechanical Reliability:** The push pin attachment system provides a precise, consistent force onto the electronic component, protecting the PCB from bowing while maintaining constant pressure for thermal efficiency. * **Material Properties:** Aluminum is used for its lightweight properties and excellent thermal conductivity, while the blue anodized finish increases emissivity and protects against corrosion. --- ### 4. Thermal Performance Example Heat sink efficiency is dependent on the velocity of the air (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Unducted) | 5.24 | | 400 (Unducted) | 3.41 | | 600 (Unducted) | 2.72 |
    ✨ Follow-up Questions
    • ⤷ How do I choose between different thermal interface materials (TIM) like T766 or T412?
    • ⤷ What is the specific PCB hole pattern required for the 45mm push pin attachment?
    • ⤷ Is there a low-profile alternative to this heat sink if I have height constraints?