ATS-12F-75-C1-R0
AI

The part number **ATS-12F-75-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series, designed primarily for cooling electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The following table breaks down the technical characteristics of the ATS-12F-75-C1-R0:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic/Brass) |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | Variable (based on Airflow) |
| **Dimensions (L x W x H)** | 45.0mm x 45.0mm x 10.0mm |
| **Pressure Spring** | Stainless Steel (R0 series) |
| **Thermal Interface Material** | T766 (High Performance Phase Change) |
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### 2. Detailed Breakdown of Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **12**: Designates the specific product family/series.
* **F**: Denotes the Fin pitch or spacing (e.g., Fine).
* **75**: Denotes the specific length/width configuration (45mm x 45mm).
* **C1**: Refers to the height of the heat sink (10mm).
* **R0**: Indicates the specific thermal interface material (T766) and the attachment hardware package.
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### 3. Key Electronic Cooling Features
* **High Performance:** The straight fin design is optimized for high-density airflow environments, ensuring maximum surface area for heat dissipation.
* **Integrated Thermal Interface (TIM):** This model comes pre-applied with **T766 phase-change material**. This eliminates the need for manual paste application and ensures uniform heat transfer between the chip and the aluminum.
* **Mechanical Reliability:** The push pin attachment system provides a precise, consistent force onto the electronic component, protecting the PCB from bowing while maintaining constant pressure for thermal efficiency.
* **Material Properties:** Aluminum is used for its lightweight properties and excellent thermal conductivity, while the blue anodized finish increases emissivity and protects against corrosion.
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### 4. Thermal Performance Example
Heat sink efficiency is dependent on the velocity of the air (LFM - Linear Feet per Minute):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (Unducted) | 5.24 |
| 400 (Unducted) | 3.41 |
| 600 (Unducted) | 2.72 |
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How do I choose between different thermal interface materials (TIM) like T766 or T412?
- ⤷ What is the specific PCB hole pattern required for the 45mm push pin attachment?
- ⤷ Is there a low-profile alternative to this heat sink if I have height constraints?