The **ATS-12F-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling of surface-mount components like BGA, FPGA, and processors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 30.00mm | | **Attachment Method** | **pushPIN™** (Plastic pins with springs) | | **Thermal Resistance** | 2.43°C/W (at 200 LFM) | | **Airflow Design** | maxiFLOW™ (Open fin pattern) | | **Compliance** | RoHS Compliant | --- ### 2. Key Design Components #### A. The maxiFLOW™ Fin Pattern Unlike standard square-cut heat sinks, the **maxiFLOW™** geometry features a flared fin structure. This design increases the surface area and creates turbulence in the airflow, which significantly enhances heat dissipation efficiency compared to traditional straight-fin designs. #### B. pushPIN™ Attachment System The "12F" in the part number indicates the specific attachment mechanism. * **Ease of Assembly:** Uses a spring-loaded plastic pin that snaps into pre-drilled holes on the PCB. * **Pressure Management:** The springs provide precise, consistent pressure on the component (TIM - Thermal Interface Material), ensuring optimal thermal contact without damaging the silicon. #### C. Thermal Interface Material (TIM) The **"C2"** suffix in the part number typically refers to the **T766** thermal phase change material or grease pre-applied to the base. This ensures that micro-gaps between the heat sink and the chip are filled, reducing thermal resistance. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **12** | Attachment Series (pushPIN™ specific) | | **F** | Fin Pitch / Style | | **47** | Size/Model identifier | | **C2** | Thermal Interface Material (Pre-applied) | | **R0** | Revision/Finish code (Blue Anodized) | --- ### 4. Applications This part is commonly used in industrial and telecommunications hardware: * **Networking Gear:** Switches and Routers. * **Computing:** High-speed RAM modules or small-form-factor CPUs. * **Embedded Systems:** Cooling FPGAs in automated manufacturing equipment.