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  • ATS-12F-35-C2-R0

  • AI
    The **ATS-12F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 22.48°C/W (Unducted), 4.34°C/W (Ducted @ 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 35.00mm x 35.00mm x 10.00mm | --- ### 2. Key Design Components #### A. Fin Profile (Fine-Pitch) The "F" in the part number indicates a **Fine-Pitch** fin design. This maximizes the surface area within a small footprint, making it ideal for high-velocity airflow environments where space is constrained. #### B. PushPIN™ Attachment System Unlike adhesive tapes, this part uses a mechanical attachment system: * **Compression Springs:** Provide precise pressure to the component, ensuring optimal thermal interface material (TIM) performance. * **Plastic or Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Material and Finish * **Aluminum:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized:** The surface treatment prevents corrosion and slightly increases emissivity for better radiant heat transfer. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS-12** | Series identifier (pushPIN™) | | **F** | Fin Pitch (Fine) | | **35** | Width/Length (35mm) | | **C2** | Thermal performance/Specific kit configuration | | **R0** | Revision code/Standard RoHS compliance | --- ### 4. Application Use Cases This specific heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Consumer Electronics:** Compact gaming consoles or high-end media players.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of using pushPIN™ over thermal adhesive tape?
    • ⤷ How does the 'Ducted' thermal resistance compare to 'Unducted' in real-world use?
    • ⤷ Is this heat sink compatible with standard 35mm BGA components?