ATS-12F-35-C2-R0
AI

The **ATS-12F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Thermal Resistance** | 22.48°C/W (Unducted), 4.34°C/W (Ducted @ 200 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions** | 35.00mm x 35.00mm x 10.00mm |
---
### 2. Key Design Components
#### A. Fin Profile (Fine-Pitch)
The "F" in the part number indicates a **Fine-Pitch** fin design. This maximizes the surface area within a small footprint, making it ideal for high-velocity airflow environments where space is constrained.
#### B. PushPIN™ Attachment System
Unlike adhesive tapes, this part uses a mechanical attachment system:
* **Compression Springs:** Provide precise pressure to the component, ensuring optimal thermal interface material (TIM) performance.
* **Plastic or Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB.
#### C. Material and Finish
* **Aluminum:** Provides a lightweight solution with high thermal conductivity.
* **Blue Anodized:** The surface treatment prevents corrosion and slightly increases emissivity for better radiant heat transfer.
---
### 3. Decoding the Part Number
The part number follows a specific nomenclature used by ATS:
| Segment | Meaning |
| :--- | :--- |
| **ATS-12** | Series identifier (pushPIN™) |
| **F** | Fin Pitch (Fine) |
| **35** | Width/Length (35mm) |
| **C2** | Thermal performance/Specific kit configuration |
| **R0** | Revision code/Standard RoHS compliance |
---
### 4. Application Use Cases
This specific heat sink is typically found in:
* **Telecommunications:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Consumer Electronics:** Compact gaming consoles or high-end media players.
- ⤷
What are the advantages of using pushPIN™ over thermal adhesive tape?
- ⤷ How does the 'Ducted' thermal resistance compare to 'Unducted' in real-world use?
- ⤷ Is this heat sink compatible with standard 35mm BGA components?