ATS-12F-124-C2-R0
AI

The **ATS-12F-124-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*, part of their "maxiFLOW" series.
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### 1. General Specifications
This part is engineered to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-12F-124-C2-R0 |
| **Product Category** | Heatsinks |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Material** | Aluminum (Blue Anodized) |
| **Fin Style** | XC-Cut (Cross-cut) |
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### 2. Physical Dimensions
The physical footprint is critical for PCB layout and clearance.
* **Length:** 50.00 mm
* **Width:** 50.00 mm
* **Height:** 25.00 mm
* **Pin Pitch:** Approximately 1.14 mm (Internal fin spacing)
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### 3. Thermal Performance
Thermal resistance determines how efficiently the part moves heat away from the silicon. The lower the $^\circ \text{C/W}$ value, the better the cooling.
| Airflow Velocity (LFM) | Thermal Resistance ($^\circ \text{C/W}$ - Unducted) |
| :--- | :--- |
| 1.0 m/s (200 LFM) | 3.18 |
| 2.0 m/s (400 LFM) | 1.81 |
| 3.0 m/s (600 LFM) | 1.45 |
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### 4. Key Design Features
* **maxiFLOW™ Design:** The unique flared fin structure maximizes the surface area for convective heat transfer while minimizing pressure drop.
* **pushPIN™ Attachment:** It uses a specialized mounting system consisting of a brass or plastic pin and a stainless steel spring. This ensures even pressure on the component to improve thermal interface performance.
* **Thermal Interface Material (TIM):** This specific part number usually comes pre-applied with **T766**, a high-performance thermal phase-change material or grease, ensuring immediate "out-of-the-box" installation.
* **Blue Anodized Finish:** The coating is not just aesthetic; it provides increased surface emissivity and protects the aluminum from environmental corrosion.
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### 5. Part Number Breakdown
The suffix code provides details on the specific configuration:
* **124:** Refers to the specific fin geometry and size within the series.
* **C2:** Indicates the material/thermal interface (usually implies a specific TIM type).
* **R0:** Refers to the revision and RoHS compliance status.
- ⤷What are the advantages of pushPIN mounting over adhesive tapes?
- ⤷ How do I calculate if this heatsink is sufficient for my 15W TDP processor?
- ⤷ What are the alternative thermal interface materials for this heatsink?