The **ATS-12D-75-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. Below is a detailed breakdown of its specifications and physical characteristics. --- ### 1. Technical Specifications This part is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-12D-75-C3-R0 | | **Heat Sink Type** | Push-pin style (for easy PCB mounting) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.51°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (with Compression Springs) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring clearance between other surface-mount components. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 25mm x 25mm | | **Height** | 20mm | | **Base Shape** | Square | | **Hole Pattern** | Designed for specific pitch requirements (usually 4 holes) | --- ### 3. Key Electronic/Thermal Features * **Fin Design:** It typically features a **Straight Fin** or **Cross-Cut** pattern. This maximizes surface area for heat dissipation via convection. * **Material Conductivity:** The use of aluminum provides a balance between lightweight design and high thermal conductivity. * **C3 Thermal Interface Material (TIM):** The "C3" suffix indicates that the part comes pre-applied with a **Phase Change Material (T766)** or specific thermal pad. This ensures there are no air gaps between the heat sink and the electronic chip, which significantly reduces thermal impedance. * **Push-Pin Mechanism:** The "R0" series uses a spring-loaded push-pin system. This provides consistent downward pressure, which is vital for maintaining thermal contact under vibration or thermal expansion/contraction. --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, or processors. * **Networking Gear:** Used in routers and switches where airflow is present. * **Power Electronics:** Dissipating heat from voltage regulators and power modules.