ATS-12D-07-C2-R0
AI

The **ATS-12D-07-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "blue ice" or push-pin series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-12D-07-C2-R0 |
| **Heat Sink Type** | Push-Pin (Passive cooling) |
| **Fin Style** | Straight (Vertical) |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm |
| **Thermal Resistance** | 16.97°C/W (at 200 LFM) |
| **Attachment Method** | Push-Pin / Spring |
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### 2. Breakdown of the Part Number
The alphanumeric string provides specific details about the component's geometry and mounting:
* **ATS:** Manufacturer prefix (Advanced Thermal Solutions).
* **12D:** Refers to the height or specific geometry series (approx. 12.7mm height).
* **07:** Indicates the length/width configuration (45mm footprint).
* **C2:** Refers to the thermal interface material (TIM) or specific coating.
* **R0:** Revision code, typically indicating the standard version of the design.
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### 3. Key Electronic Functions
While this is a mechanical component, it plays a critical role in electronics:
1. **Thermal Management:** It increases the surface area of a hot semiconductor, allowing heat to dissipate into the surrounding air via convection.
2. **Protection:** By maintaining the junction temperature ($T_j$) within safe limits, it prevents thermal throttling and permanent damage to integrated circuits (ICs).
3. **Mechanical Attachment:** The "Push-Pin" design uses a spring-loaded mechanism to ensure consistent pressure between the heat sink and the chip, maximizing the effectiveness of the thermal paste.
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### 4. Typical Applications
* **Networking Gear:** Routers, switches, and modems.
* **Embedded Systems:** Industrial PCs and controllers.
* **Automotive Electronics:** Power management modules.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
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- ⤷
What is the significance of the 'Blue Anodized' finish on this heat sink?
- ⤷ How do you calculate the required thermal resistance for a specific chip?
- ⤷ What is the difference between this push-pin model and an adhesive-mount heat sink?