The **ATS-12B-151-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling semiconductors and integrated circuits (ICs). It is manufactured by Advanced Thermal Solutions, Inc. (ATS) as part of their "pushPIN™" line. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push-Pin) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Brass) | | **Dimensions** | 35.0mm x 35.0mm x 20.0mm | | **Thermal Resistance** | 3.93°C/W (at 200 LFM) | | **Spring Type** | Stainless Steel (Compression) | | **Interface Material** | T766 (Phase Change Material) | --- ## 2. Key Component Breakdown ### A. Fin Design (Cross-Cut) This model utilizes a **cross-cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in dense electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. ### B. Push-Pin Attachment Mechanism Instead of using adhesive tape or screws, this part uses a **spring-loaded push-pin** system: * **Ease of Installation:** It snaps into pre-drilled holes on the PCB. * **Constant Pressure:** The compression springs ensure a consistent force is applied to the thermal interface material (TIM), maximizing heat transfer from the chip to the aluminum. ### C. Thermal Interface Material (T766) The base comes pre-applied with **T766**, a high-performance thermal pad. This material fills the microscopic air gaps between the heat sink and the electronic component (CPU, FPGA, or GPU), significantly reducing thermal resistance. --- ## 3. Performance Data Thermal performance is measured by the degree of temperature rise per watt of power (measured in °C/W). | Air Velocity (LFM) | 100 | 200 | 400 | 600 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 6.48 | 3.93 | 2.73 | 2.23 | --- ## 4. Typical Applications * **Embedded Systems:** Industrial PCs and IoT gateways. * **Networking Gear:** Cooling for routers, switches, and small-form-factor servers. * **Power Electronics:** High-voltage regulators and power MOSFETs. ---