The **ATS-12B-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Product Specifications | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-12B-06-C3-R0 | | **Product Category** | Passive Cooling / Heat Sinks | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits the target IC (Integrated Circuit) without interfering with adjacent surface-mount devices (SMDs). * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Depth):** 10.00 mm * **Pin Pitch:** 1.27 mm (Standard for this series) --- ### 3. Thermal Performance Thermal resistance is the most critical electronic metric for this part, as it determines how efficiently heat is transferred away from the semiconductor junction. | Airflow Velocity | Thermal Resistance (°C/W) - Unducted | | :--- | :--- | | **@ 100 LFM (0.5 m/s)** | 20.27 | | **@ 300 LFM (1.5 m/s)** | 6.44 | | **@ 500 LFM (2.5 m/s)** | 4.31 | | **@ 700 LFM (3.5 m/s)** | 3.42 | --- ### 4. Key Electronic Features * **Fine Pitch Fin Design:** The "Fine-Pitch" geometry increases the surface area, making it ideal for high-density PCB layouts where space is limited but heat dissipation requirements are high. * **pushPIN™ Attachment:** This specific model uses a specialized attachment mechanism that includes a high-performance thermal interface material (TIM) pre-applied to the base. * **C3 Classification:** The "C3" in the part number typically refers to a specific variation in the spring/pin pressure or the type of thermal interface material (TIM) used to ensure a low-resistance path between the component and the sink. ### 5. Application Use-Cases This heat sink is commonly used for cooling: 1. **BGA (Ball Grid Array) Packages:** CPUs, GPUs, or FPGAs. 2. **Power Electronics:** Voltage regulators and high-speed chipsets. 3. **Telecommunications Gear:** Routers and switches where vertical clearance is limited (10mm height).