The **ATS-11F-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance** | 1.53° C/W (@ 200 LFM) | | **Fin Style** | Straight (maxiFLOW™ Tapered) | | **Compliance** | RoHS Compliant | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-54** thermal interface material. This ensures maximum heat transfer between the electronic chip and the aluminum base by filling microscopic air gaps. #### B. pushPIN™ Attachment System This heat sink utilizes a specialized mechanical attachment system: * **Precision Springs:** Provides consistent pressure to ensure the TIM stays compressed. * **Hardware:** Includes brass or plastic pins that lock into the PCB, reducing the risk of the heat sink shifting during vibration. #### C. maxiFLOW™ Design Unlike standard extruded heat sinks, the maxiFLOW™ profile features a flared fin geometry. This design: * Increases the surface area for convection. * Reduces pressure drop, allowing air to flow more freely through the fins even in high-density electronic enclosures. --- ### 3. Application Use Cases This specific model is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Compact systems requiring passive or active cooling. * **Power Supplies:** Cooling MOSFETs or power conversion modules.