The **ATS-11F-96-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, which is designed to provide secure, high-pressure attachment to printed circuit boards (PCBs). ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-11F-96-C2-R0 | | **Material** | Aluminum | | **Fin Type** | Fine Pitch (Square) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.63 °C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### Core Electronic & Mechanical Components #### 1. Heat Sink Body The body is constructed from **Aluminum (6063)**. Aluminum is used for its excellent thermal conductivity and lightweight properties. The "Fine Pitch" design increases the surface area, allowing for efficient heat dissipation through convection. #### 2. pushPIN™ Attachment Mechanism Unlike traditional adhesive tapes, this part uses a spring-loaded push-pin system. This provides: * **Constant Pressure:** Ensures the heat sink maintains firm contact with the component (CPU/GPU/FPGA). * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Reusability:** Can be easily removed and reinstalled for maintenance. #### 3. Thermal Interface Material (TIM) The model comes pre-applied with **T766**. The TIM is critical because it fills microscopic air gaps between the electronic component and the metal heat sink, significantly lowering thermal resistance. #### 4. Springs and Pins The "R0" designation typically refers to the specific hardware kit included. The springs are calibrated to provide specific "Force per Square Inch" to protect delicate silicon dies while ensuring thermal efficiency. --- ### Performance Data The cooling efficiency depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 | 5.63 °C/W | | 200 | 1.96 °C/W | | 400 | 1.15 °C/W | | 600 | 0.82 °C/W |