The part number **ATS-11F-92-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "pushPIN™" family of thermal management solutions, designed for efficient cooling of electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Fine-Pitch (High Efficiency) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48 °C/W (at 100 LFM) | | **Fin Pattern** | XC-CUT (Cross-cut) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of Part Number Nomenclature The part number can be decoded as follows to understand the specific configuration: * **ATS:** Brand (Advanced Thermal Solutions). * **11:** Series (pushPIN™ Heat Sink). * **F:** Fin profile (indicates specific pitch and density). * **92:** Size/Configuration code. * **C2:** Material/Finish (usually indicates Blue Anodized Aluminum). * **R0:** Revision/Packaging code. --- ### 3. Key Electronic Cooling Features * **Push-Pin Attachment:** This uses a flexible, spring-loaded mechanism that ensures even pressure across the electronic chip. This prevents damage to delicate silicon while maximizing thermal transfer. * **XC-CUT Fin Design:** The fins are cross-cut, which allows for multi-directional airflow. This is critical in cramped electronic enclosures where air may not flow in a perfectly straight line. * **Pre-applied TIM:** It comes with **T766 thermal interface material**, which eliminates the need for manual thermal paste application during PCB assembly. * **Standard Mounting:** Designed for a hole pattern of 33mm x 33mm, making it compatible with many standard PCB layouts. --- ### 4. Typical Applications This specific heat sink is commonly used in: 1. **Networking Hardware:** Switches, routers, and high-speed modems. 2. **Embedded Computing:** Industrial PC boards and single-board computers (SBCs). 3. **Power Electronics:** Voltage regulators and power converters that generate significant localized heat.