The **ATS-11F-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *maxiFLOW™* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and design characteristics. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-11F-75-C3-R0 | | **Heat Sink Type** | maxiFLOW™ (High Performance) | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 20.00mm | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Interface Material** | T412 (Thermal Tape) | --- ### 2. Key Design Features The "maxiFLOW" design is engineered for maximum surface area and optimized airflow. * **Tapered Fin Design:** The fins are designed with a graduated profile to increase surface area while minimizing the pressure drop as air passes through the heat sink. * **Push-Pin Attachment:** It uses a plastic push-pin mechanism with a built-in spring. This ensures consistent pressure between the heat sink and the electronic component (CPU, GPU, or FPGA), which improves thermal conductivity. * **Pre-Applied Thermal Interface Material (TIM):** The unit comes with **T412** thermal tape pre-applied to the base, simplifying the assembly process and ensuring a reliable bond. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **11** | Series Number | | **F** | Fin Style (e.g., Fine/Flared) | | **75** | Specific footprint/size identifier | | **C3** | Thermal Interface/Attachment variant | | **R0** | RoHS Compliant version | --- ### 4. Typical Applications This heat sink is commonly used in high-heat density electronic environments where space is limited but cooling demands are high: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** High-speed processing boards. * **Power Electronics:** Voltage regulators and power modules. ---