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  • ATS-11F-52-C2-R0

  • AI
    The **ATS-11F-52-C2-R0** is a high-performance heat sink assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Copper (optional variants) | | **Finish** | Blue Anodized | | **Dimensions** | 35.0mm x 35.0mm | | **Height** | 25.0mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.07 °C/W (at 200 LFM) | | **Fin Pattern** | Straight Fin | --- ## 2. Key Electronic Components & Features ### A. The pushPIN™ Attachment System Unlike traditional adhesive-based heat sinks, the **ATS-11F-52-C2-R0** uses a mechanical attachment system. * **Plastic Push Pins:** Used to secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** Provides precise, uniform pressure (measured in PSI) across the interface, ensuring optimal contact with the electronic component. ### B. Thermal Interface Material (TIM) The part number suffix typically indicates that the unit comes with **pre-applied thermal interface material**. This replaces the need for manual application of thermal paste, ensuring a low-resistance path for heat to flow from the silicon die to the aluminum fins. ### C. Fin Geometry (Straight Fin) The straight-fin design is optimized for **forced air convection**. In an electronic enclosure with a system fan, air flows through these channels to dissipate heat efficiently. --- ## 3. Order Code Breakdown Understanding the specific part number helps in identifying the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS-11** | Series Identifier (pushPIN™ Heat Sink) | | **F** | Fine Pitch (Fin density) | | **52** | Specific mechanical dimensions/kit type | | **C2** | Thermal Performance/Material Class | | **R0** | RoHS Compliant / Revision code | --- ## 4. Typical Applications * **Telecom & Networking:** Cooling high-speed processors in switches and routers. * **Embedded Systems:** Industrial PCs where mechanical stability is required (vibration resistance). * **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs).
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom thermal interface material?