ATS-11F-52-C2-R0
AI

The **ATS-11F-52-C2-R0** is a high-performance heat sink assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body), Copper (optional variants) |
| **Finish** | Blue Anodized |
| **Dimensions** | 35.0mm x 35.0mm |
| **Height** | 25.0mm |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 1.07 °C/W (at 200 LFM) |
| **Fin Pattern** | Straight Fin |
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## 2. Key Electronic Components & Features
### A. The pushPIN™ Attachment System
Unlike traditional adhesive-based heat sinks, the **ATS-11F-52-C2-R0** uses a mechanical attachment system.
* **Plastic Push Pins:** Used to secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB).
* **Compression Springs:** Provides precise, uniform pressure (measured in PSI) across the interface, ensuring optimal contact with the electronic component.
### B. Thermal Interface Material (TIM)
The part number suffix typically indicates that the unit comes with **pre-applied thermal interface material**. This replaces the need for manual application of thermal paste, ensuring a low-resistance path for heat to flow from the silicon die to the aluminum fins.
### C. Fin Geometry (Straight Fin)
The straight-fin design is optimized for **forced air convection**. In an electronic enclosure with a system fan, air flows through these channels to dissipate heat efficiently.
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## 3. Order Code Breakdown
Understanding the specific part number helps in identifying the exact variant:
| Segment | Meaning |
| :--- | :--- |
| **ATS-11** | Series Identifier (pushPIN™ Heat Sink) |
| **F** | Fine Pitch (Fin density) |
| **52** | Specific mechanical dimensions/kit type |
| **C2** | Thermal Performance/Material Class |
| **R0** | RoHS Compliant / Revision code |
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## 4. Typical Applications
* **Telecom & Networking:** Cooling high-speed processors in switches and routers.
* **Embedded Systems:** Industrial PCs where mechanical stability is required (vibration resistance).
* **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs).
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What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a custom thermal interface material?