The **ATS-11F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ## 1. Technical Specifications The part number provides specific data regarding the dimensions, thermal resistance, and attachment method. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 10mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~9.28°C/W (Unducted Flow) | | **Fin Type** | XC-Cut (Cross-cut) | --- ## 2. Key Design Features ### A. Fin Geometry (XC-Cut) The "XC-Cut" refers to a straight-fin design that has been cross-cut. This creates a matrix of pins/fins that allows for **omnidirectional airflow**. This is highly beneficial in electronics where the direction of the system fan’s air intake might not be perfectly aligned with the heatsink orientation. ### B. Attachment Mechanism * **Push-Pins:** This model uses two plastic push-pins that pass through pre-drilled holes in the PCB. * **Springs:** The pins include a compression spring to ensure even pressure across the component being cooled, improving the efficiency of the Thermal Interface Material (TIM). ### C. Material and Finish * **Aluminum 6063:** Provides a good balance between thermal conductivity and weight. * **Blue Anodizing:** Besides aesthetics, the anodized layer increases the surface emissivity and protects the aluminum from corrosion. --- ## 3. Applications This specific part is typically used to cool low-to-medium power integrated circuits (ICs) including: * **BGA Packages:** Modern processors, FPGAs, and GPUs. * **Telecommunications Gear:** Routers and switch chipsets. * **Embedded Systems:** Industrial PC controllers and power modules. --- ## 4. Thermal Performance Overview Performance is measured by how effectively the part dissipates heat relative to airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 4.42 | | 400 | 2.0 | 2.82 | | 600 | 3.0 | 2.13 |