The **ATS-11F-34-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic) | | **Heat Sink Type** | XC-Cut (Cross-cut) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 3.81°C/W @ 200 LFM | | **Pressure** | Standard (High performance) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Breakdown ### A. Fin Geometry (XC-Cut) The unit features a **cross-cut** fin design. Unlike standard straight fins, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where air may not flow in a perfectly straight line from a single fan. ### B. Attachment System: Push Pins & Springs Instead of using messy thermal adhesives or tapes, this model uses a **Push Pin** mechanism. * **Ease of Install:** Pins snap into pre-drilled holes on the PCB. * **Consistent Pressure:** Built-in springs ensure the heat sink is pressed against the chip with uniform force, which optimizes thermal transfer. ### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This isn't just for aesthetics; the anodized layer increases surface emissivity (radiative heat transfer) and provides corrosion resistance. --- ## 3. Thermal Performance Metrics Thermal performance is measured by thermal resistance ($\theta$). A lower value indicates better heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.81 | | 300 (1.5 m/s) | 2.57 | | 400 (2.0 m/s) | 2.02 | | 500 (2.5 m/s) | 1.72 | --- ## 4. Usage Considerations When integrating the ATS-11F-34-C2-R0 into a design, engineers must ensure: 1. **PCB Hole Pattern:** The motherboard must have specific mounting holes that align with the 35mm pin spacing. 2. **Component Height:** Ensure the 25mm height does not interfere with other stacked components or the enclosure lid. 3. **TIM Integrity:** The pre-applied **T766** phase-change material is highly effective but should be protected from dust and skin oils prior to installation.