The **ATS-11D-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling high-power semiconductors and integrated circuits (ICs). --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Line** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.29 °C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 10mm | | **Weight** | 32 grams | --- ### ### Key Electronic & Mechanical Features #### 1. Heat Sink Design (Fine Pitch) The part features a **straight-fin** design. This is optimized for high-velocity airflow environments where air can be forced through the fins to dissipate heat from the electronic component (CPU, FPGA, or GPU) into the surrounding environment. #### 2. pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this part uses a **push-pin and compression spring** mechanism. * **Precision Cooling:** Provides consistent pressure across the interface for maximum heat transfer. * **Reliability:** Prevents the heat sink from shifting during mechanical shock or vibration. #### 3. Thermal Interface Material (TIM) The "C3" in the part number indicates that this unit comes pre-applied with **ATS-PPS-01**, a high-performance thermal interface material. This fills the microscopic air gaps between the component and the heat sink. #### 4. Material Efficiency The use of **AL6063 aluminum** provides a high thermal conductivity-to-weight ratio, ensuring the electronic assembly does not become overly heavy while maintaining effective cooling. --- ### ### Application Use Cases * **Networking Hardware:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint.