### Technical Overview: ATS-11D-72-C2-R0 The **ATS-11D-72-C2-R0** is a high-performance **heat sink** assembly manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Body) / Blue Anodized Finish | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Resistance** | 5.11°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Interface Material** | T766 Phase Change Material (Pre-applied) | --- ### 2. Design Components #### A. The Heat Sink Body The part is constructed from lightweight aluminum. The blue anodized coating is not just for aesthetics; it provides surface protection and slightly improves thermal emissivity. The **straight fin** design is optimized for unidirectional airflow. #### B. The Attachment Mechanism (Push-Pin) The "11D" designation indicates the specific mounting hardware. It utilizes: * **Plastic Push-Pins:** Quick installation into pre-drilled holes on a PCB. * **Compression Springs:** These ensure a consistent and reliable downward pressure, which is critical for maintaining contact between the component and the heat sink. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the unit comes with **T766** pre-applied. This is a phase-change material that transitions into a liquid-like state at operating temperatures, filling microscopic air gaps to significantly reduce thermal impedance. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 5.11 | | **400** | 3.33 | | **600** | 2.82 | --- ### 4. Implementation Considerations * **PCB Hole Pattern:** Requires a specific hole spacing on the motherboard to accommodate the push-pins. * **Height Clearance:** At 25mm tall, it is a medium-profile sink; ensure no top-side interference with adjacent daughterboards or enclosures. * **Flow Direction:** Because it uses straight fins, airflow must be directed parallel to the fins for maximum efficiency.