The **ATS-11D-41-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin style heat sink** designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The part number follows the Advanced Thermal Solutions (ATS) nomenclature, which defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.03°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Brass with Plastic Ends) | | **Spring Type** | ATS-PPS-11 | --- ## 2. Dimensional Data Precise sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 40.00 mm | | **Width (B)** | 40.00 mm | | **Height (C)** | 20.00 mm | | **Pitch (E)** | 45.00 mm | | **Pitch (F)** | 45.00 mm | --- ## 3. Key Electronic Components & Features ### A. Fin Design The unit utilizes a **straight-fin** or **cross-cut** design (depending on the specific sub-variant of the 41-series). This maximizes surface area for heat dissipation via convection. The "C2" in the part number indicates a specific thermal interface material or performance grade. ### B. Push-Pin Mounting System Instead of using adhesive tapes which can degrade over time, this part uses a mechanical **Push-Pin** system: * **Compression Springs:** Provides consistent pressure for optimal thermal contact. * **Secure Attachment:** Prevents the heat sink from shifting during vibration or shipping. * **Hole Pattern:** Requires pre-drilled holes in the PCB (usually 3.0mm diameter). ### C. Thermal Interface Material (TIM) Most ATS heat sinks in this category come with a **pre-applied Thermal Interface Material**. This fills the microscopic air gaps between the heat sink base and the electronic chip (CPU, GPU, or FPGA), significantly lowering the contact resistance. --- ## 4. Application Use Cases This component is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PC controllers. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Computing:** Secondary chipsets on motherboards.