The **ATS-11D-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** line, designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.93°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 10.00 mm | | **Pitch** | Fine Pitch | --- ### 2. Key Electronic & Mechanical Components #### A. Heat Sink Body (The Fins) The device uses a **straight-fin design** (fine pitch). In electronics, the fins increase the surface area available for heat dissipation. The 10mm low-profile height makes it suitable for compact enclosures where vertical space is limited. #### B. The pushPIN™ Attachment System This is a mechanical assembly consisting of: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB. * **Compression Springs:** These provide precise, even pressure (Uniform Compression) across the thermal interface material (TIM). This ensures the most efficient heat transfer from the chip to the aluminum. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 thermal phase change material**. * **Function:** It fills microscopic air gaps between the component and the heat sink. * **Efficiency:** Phase change materials offer better performance than standard pads by softening at operating temperatures to create a thinner, more conductive bond. --- ### 3. Thermal Performance Profile The effectiveness of this part depends on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.93 | | 300 (1.5 m/s) | 2.22 | | 500 (2.5 m/s) | 1.73 | | 700 (3.5 m/s) | 1.51 | --- ### 4. Implementation Example To use this part in a PCB design, the board must have pre-drilled holes to accommodate the pushPIN™ spacing. ```markdown # PCB Layout Requirements - Hole Diameter: 3.175mm (approx) - Hole Spacing: 30.00mm x 30.00mm (Center to Center) - Thermal Pad Area: 35.00mm x 35.00mm ```