The **ATS-11D-101-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Electronic Component Breakdown #### A. The Heat Sink (Thermal Dissipation) The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The **Straight Fin** design is optimized for high-airflow environments (active cooling), allowing air to flow through the channels to carry heat away from the semiconductor. #### B. Attachment System (Mechanical Integration) The "11D" series uses a **Push-Pin and Spring** mechanism. * **Push-Pin:** Allows for easy installation onto a PCB with pre-drilled holes. * **Spring:** Provides consistent "force" or pressure on the electronic chip, ensuring the heat sink stays in contact even during vibration or thermal expansion. #### C. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. In electronics, the TIM is crucial because it fills microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Thermal Performance Matrix Performance is dependent on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 6.67 | | 300 (Medium) | 2.80 | | 500 (High) | 2.10 | --- ### Summary of Use Case The **ATS-11D-101-C2-R0** is best suited for medium-to-large electronic packages where a secure, vibration-resistant mount is required. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection against corrosion and slightly improves heat radiation.