The **ATS-11D-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs (Printed Circuit Boards). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 12.7mm (Low Profile) | | **Thermal Resistance** | 16.97 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Design and Components The part is engineered to provide efficient heat dissipation for BGAs (Ball Grid Arrays) and other surface-mount chips. * **Heat Sink Body:** Constructed from Aluminum 6063, which offers high thermal conductivity while remaining lightweight. The blue anodized coating prevents corrosion and improves emissivity. * **Straight Fin Pattern:** The "Straight Fin" design is optimized for environments with high-velocity airflow (forced convection), allowing air to pass through the channels with minimal pressure drop. * **Push-Pin Attachment:** * **Pins:** Usually made of brass or plastic; this model uses durable brass. * **Springs:** Provides a consistent "Pre-load" force, ensuring the heat sink stays in contact with the component even under mechanical shock or vibration. --- ### 3. Applications This specific heat sink is commonly found in: 1. **Telecommunications:** Cooling networking processors and switches. 2. **Embedded Systems:** High-speed computing modules where vertical space is limited. 3. **Power Supplies:** Regulating the temperature of MOSFETs or voltage regulators. --- ### 4. Mounting Hole Compatibility To use this part, the PCB must have a specific hole pattern. The "11D" series generally corresponds to a specific pitch (distance between holes). * **Hole Diameter:** Typically requires 3.0mm diameter holes in the PCB. * **Thermal Interface Material (TIM):** This part is often pre-applied with "T766" or similar high-performance thermal tape or grease to ensure maximum heat transfer from the chip to the aluminum fins.