The **ATS-11B-72-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-11B-72-C2-R0 | | **Heat Sink Type** | Push-Pin (BGA Heat Sink) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Interface Material** | T766 (High Performance) | | **Thermal Resistance** | 5.11°C/W (at 1.0 m/s airflow) | | **Fin Style** | Straight Fin | --- ### 2. Electronic Component Breakdown #### A. The Heat Sink Body The core component is an aluminum extrusion. Aluminum is used for its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves emissivity for radiant heat transfer. #### B. The Push-Pin Mechanism Unlike adhesive tapes or clips, this part uses a mechanical push-pin system: * **Plastic Pins:** Inserted into pre-drilled holes in the PCB. * **Springs:** Specifically a "Brass" spring that provides a constant force (pressure) between the heat sink and the electronic chip, ensuring optimal thermal contact even under mechanical vibration. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the pre-applied thermal material. The **T766** is a phase-change or high-performance pad that fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Part Number Nomenclature (Decoding) To understand variations of this part, here is how the nomenclature works: | Segment | Meaning | | :--- | :--- | | **ATS-11** | Series (Push-Pin Heat Sink) | | **B** | Material/Process (Aluminum) | | **72** | Specific mechanical/fin dimensions | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant status | --- ### 4. Integration Considerations * **PCB Hole Pattern:** This part requires specific hole placements on the PCB to accommodate the push-pins. * **Airflow Direction:** As a straight-fin heat sink, it is most effective when airflow is directed parallel to the fins. * **Vertical Clearance:** Ensure the 15mm height does not interfere with neighboring components or the device chassis.