The **ATS-1104-C1-R0** is a high-performance, ultra-low profile heat sink designed by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, which focuses on providing high-performance cooling for electronic components in space-constrained environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Length/Width** | 19.0 mm x 19.0 mm | | **Height** | 4.0 mm | | **Thermal Resistance** | 13.5 °C/W (at 200 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | superGRIP™ Clip and Thermal Pad | | **Fin Style** | Straight | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body The main body is constructed from aluminum with a **blue anodized finish**. Anodizing is not just for aesthetics; it provides: * **Increased Surface Emissivity:** Enhances radiant heat transfer. * **Corrosion Resistance:** Protects the metal from environmental degradation. * **Electrical Insulation:** The oxide layer provides minor protection against short-circuiting if it touches exposed traces. #### B. The superGRIP™ Attachment System Unlike many consumer heat sinks that use permanent epoxy, the ATS-1104-C1-R0 uses a specialized clip system: 1. **Plastic Frame:** A high-temperature plastic frame snaps onto the electronic component (usually a BGA or CPU/FPGA). 2. **Stainless Steel Clip:** A "C-clip" provides a constant force (pressure), ensuring optimal contact between the heat sink and the chip. 3. **No Hole Mounting:** This system allows the heat sink to be mounted without drilling holes in the PCB, saving valuable board space for traces. #### C. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a pre-applied high-performance **thermal pad**. This material fills the microscopic air gaps between the silicon chip and the aluminum base to maximize thermal conductivity. --- ### 3. Common Applications This part is specifically engineered for cooling dense electronic assemblies: * **Networking Hardware:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling small power ICs or MOSFETs. * **Telecommunications:** Base station hardware where vertical clearance is limited. ---